Electroplated Copper Layer (Cu)

High-purity electroplated Copper (Cu) layer for electrochemical energy storage, catalysis and interfacial engineering research.

Applications

• current collectors and conductive layers in battery research
• electroplated contacts and busbars
• electrochemical corrosion and deposition studies
• electrocatalysis on copper surfaces

Materials and composition

Available in the following material classes: metals, metal alloys.

Layer and substrate

Applied on metal substrates, custom substrates, with layer thickness in the nm to µm range.

Customization

Thickness, substrate, geometry can be tailored on request.