High-purity ultra-thin Copper (Cu) film for advanced materials and electrochemical research, engineered to a precise and reproducible surface.

Applications

• conductive layers in microelectronics
• interconnects and contacts
• catalysis (e.g. CO2 reduction)
• energy storage systems
• antimicrobial coatings
• surface science and oxidation studies

Materials and composition

Available in the following material classes: metals, oxides (e.g. Cu2O, CuO).

Substrate and thickness

Deposited on glass, silicon, metal substrates, custom substrates, with thickness in the nm to µm range.