High-purity electroplated Gold (Au) layer for electrochemical energy storage, catalysis and interfacial engineering research.

Applications

• high-reliability electrical contacts and connectors
• corrosion-resistant and decorative coatings
• electrodes and sensor surfaces in electrochemical systems
• functional layers for microelectronics and packaging

Materials and composition

Available in the following material classes: metals, metal alloys.

Layer and substrate

Applied on metal substrates, custom substrates, with layer thickness in the nm to mm range.

Customization

Thickness, substrate, geometry can be tailored on request.